Check out our latest video demonstration of the PE-25 plasma cleaner.
The informative video is just over a minute long yet outlines just how easy it is to clean or etch with a Plasma Etch system.
For more information about the PE-25 plasma cleaner, visit the PE-25 page on our website.
The PE-25 is our entry level, very affordable plasma cleaner. It’s a robust machine that is perfect for small production facilities, research labs, universities, or any industry needing a small-scale, affordable plasma solution.
The PE-25 excels at all types of cleaning and bonding.
All of our plasma cleaners and etchers are built in the USA at our factory in Carson City, Nevada.
This unit is the best value on a plasma cleaner you will find.
Have you seen the future of etching? The Magna Series PCB etching system is the first plasma etching system used in the manufacturing production of PCBs without CF4! Our patented system uses only 3-phase power and compressed air.
The technology inside the Magna completely eliminates the need for CF4 gas which is presently used by PCB manufacturers’ plasma etching systems, including desmear and etch back systems.
Magna is the next generation replacement for our time proven MK-II line of systems for desmear and etch back applications. As the results show, Magna sets new market standards in several key areas.
Magna’s revolutionary technology provides faster etch times, lower operating cost, lower power usage, and incredible process uniformity not achievable using any other technology. Magna provides precision and uniform etching on both sides of panels simultaneously.
The Magna is a great choice benefiting both customers and our environment. Magna customers experience higher levels of uniformity and lower operating costs. The environment also benefits from a reduction in green house gas exhaust.
We will be providing live demonstrations of our popular PE-50 Plasma Cleaner to attendees at the Med Tech World MD&M West 2016 trade show. The show runs February 9 – 11 at the Anaheim Convention Center in Anaheim, California.
This is a great opportunity for any of you, but especially medical design manufacturers to get your hands on a working PE-50 Plasma Cleaner. We will have company representatives on hand to answer questions and provide live demonstrations. Come find us at booth number 2078.
The PE-50 is an affordable, entry level option for most types of plasma treatment. This unit is very popular at universities and research labs. We credit the PE-50’s success to its versatility and robust design. This system is popular for small production facilities, research labs, universities, and startup manufacturers in need of a small-scale, cost-effective plasma treatment solution.
The opening price point includes industry leading features such as an oxygen safe vacuum pump and the ability to run two gasses simultaneously. The PE-50 features simple controls and easy to read indicators for monitoring the plasma processing sequence.
If you don’t make it to the show, you can view all of our products anytime on our website: www.plasmaetch.com
Don’t forget to click on the live chat and say “hi!”
A strong, reliable bond couldn’t be more important for the longevity of today’s products. Today’s plasma technology can reduce electrical resistance, while increasing physical strength of solders and bonding agents. Bonding two dissimilar materials is especially difficult, but plasma helps secure a superior bond every time.
Plasma treatment allows a strong bond between two dissimilar materials, such as a wood and rubber. The plasma treated surfaces are cleaned to the atomic level, allowing a similar bonding agent to properly bond to both materials.
As a general rule, a line pull test can measure the bond strength.
Printing on glossy surfaces such as plastic or Teflon has the potential to result in a poor quality. Plasma treatment cleans and modifies the surface so that ink will apply to a glossy rubber as if it were paper!
Plasma can even allow printing colors on Teflon!
Failure Rate Reduction
Plasma cleaning and surface modification can reduce failure rates among PCB manufacturing, including wire bonding. This results in more reliable products through stronger bonds and less electronic resistance.
The surface modification effects are not permanent. The time available for processing ranges from just a few hours to a few days. Although the effects of the plasma treatment are temporary, they allow plenty of time to complete the manufacturing or printing process on the materials being treated.
Process temperature is the single most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity.
The temperature at which the process operates has a major influence on processing rates. The higher the process temperature, the faster the processing rate.
Process temperature control is mandatory when processing temperature sensitive devices. Uncontrolled process temperatures can cause distortion, delaminating, and discoloration, and can chemically modify the properties of temperature sensitive devices.
• Process temperature is regulated by the patented electrode temperature control system. Electrode temperatures are maintained by continuously recalculating a heat transfer fluid through the electrodes. (See diagram below.)
• The boards are loaded directly onto the temperature controlled electrode surfaces.
• Process temperature is independent of the plasma process and programmable in the range of O°F to 300°F ± 0.5°F.
• An elevated process temperature is selected which is compatible with the type of board material (epoxy, polyimide, acrylic/kapton, Teflon, etc.) being processed, while maintaining maximum processing throughput.
• The temperature control system is a patented feature, unique to the Plasma Etch product line.
8 reasons to utilize Plasma Etch Plasma temperature control technology:
1. Process temperature is constant throughout the plasma sequence. No ramping of temperature occurs during the plasma process. (See graph below.)
2. Etch rates are predictable and repeatable, due to steady state process temperature.
3. Etch rates are accelerated by using elevated process temperatures.
4. No throughput limiting temperature stabilization sequencing (“dummy plasma cycling”) is required.
5. Start and stop system operation requires no throughput limiting temperature stabilization cycle.
6. Temperature control is independent of the plasma process.
7. Temperature control techniques use proven and highly reliable design (recirculation heat transfer fluid). No temperature control elements are exposed to the plasma process.
8. Any process temperature from 175°F to 300°F may be selected for compatibility with all board materials. Optionally, the temperature range may be extended from O°F to 300°F.
CURVE I (Plasma Etch Temperature Profile)
1. Points A and B are the respective starting and the ending points of the plasma process sequence.
2. Processing temperature is essentially constant throughout the plasma sequence. Any temperature within the control range may be selected and is automatically maintained.
3. Constant process temperature ensures plasma process repeatability.
CURVE II (Typical Competition Temperature Profile)
1. Points C and D are the respective starting and the ending points of the plasma process sequence.
2. The starting temperature at point C is undefined, as it depends on residual system heat from the previous process cycle.
3. The slope of tile temperature profile from point C to point D is dependent on the thermal loading effect of the materials (mass of the load) being processed and the plasma processing parameters (primarily R.F. power level).
4. The ending temperature at point D is a variable, as it is dependent on items 2 and 3 above.
5. The repeatability of the plasma process is severely impaired by this lack of a constant processing temperature.
The versatility of plasma technology is one of its most important advantages.
Because plasma is made up of dissociated positively and negatively charged particles (in addition to neutral particles), it will react with a wide variety of substances.
And because the process can be readily controlled and reproduced, plasma can be used to clean, etch, or coat almost any surface without the safety hazards and liquid waste associated with wet processes.
Plasma etching technology can remove organic and inorganic contamination, increase wettability, increase bond strength, and remove residue. If effective surface treatments critical to the efficiency of a process or the reliability of a product, plasma technology may be the best answer.
For years, manufacturers in the electronics sector have used plasma technology for a variety of surface modification and etching applications. Developments and innovations in the field of plasma technology have dramatically expanded the capabilities and potential uses of this clean, safe, cost-effective process.
Plasma etching systems are now utilized for surface activation, etching, and deposition with a variety of materials. The plasma process can render most materials:
• Hydrophilic (Wettable)
• Hydrophobic (Non Wettable)
• Abrasion Resistant
• Many Other Uniquely Engineered Surface Characteristics
The versatility of the plasma process means that it can be used for a full range of cleaning and etching tasks, from removing small amounts of contaminants in a final clean process, to the more demanding job of desmear and etchback in the printed circuit board industry.
Plasma is often used to clean odd-shaped parts with areas that are not readily accessible, such as blind holes. It can also clean assemblies made of different materials.
Plasma is exceptionally useful when bonding two materials of different origins, such as wood and metal, or rubber and plastic. When each surface is 100% free of contaminates, or “plasma clean”, significantly stronger bonds can be achieved.
The plasma etching process occurs in a vacuum and uses radio frequency energy, instead of heat, to create plasma that produces the desired reaction with the surface that it is treating. This helps to avoid heat damage and promote safety.
The process is highly controllable and repeatable, ensuring uniform results – product to product, and batch to batch.
Plasma can, in many cases, eliminate the need for CFCs and other solvents. This will, in turn, reduce costly disposal of hazardous by-products.
To find out more about how Plasma Etch might be able to help you improve your processes or products, visit our website.