Plasma Etch Announces the MK-II Vertical

Press Release Summary:

  • Available in 6, 12 and 24 board configurations
  • Can be used as an isotropic plasma etcher or as plasma cleaner for surface activation and organics removal
  • Used to prep Teflon surfaces for plating and to remove carbon after laser drilling

Carson City, NV – Plasma Etch Inc, a leader in plasma innovation, recently announced the MK-II Vertical, a circuit board desmear and etch back system designed to hang boards vertically between electrodes.

The system can be used as an isotropic (omni-directional) plasma etcher or as a plasma cleaner for surface activation and organics removal. Additionally, it can be used to prep Teflon surfaces for plating and to remove carbon after laser drilling.

The MK-II Vertical features the company’s computer control system with easy to use software. Also included is the company’s patented temperature control system to provide class leading uniformity across circuit boards.

The MK-II Vertical is available in 6, 12, and 24 board configurations. It is designed to hold 18” by 24” panels, but other sizes are also available.

Plasma Etch officials boast that plasma is the most environmentally friendly way to etch circuit boards: “We can remove drilling smear with no chemicals and very little environmental impact.”

This newest addition to Plasma Etch’s line of systems is available to order on their website:

About Plasma Etch

Plasma Etch has been a leading manufacturer and industry innovator since 1980. The company holds several patents for the invention, development, and manufacturing of groundbreaking innovations, paving the way for plasma technology and the enhancement of quality manufacturing worldwide. Plasma Etch specializes in plasma cleaning solutions of all sizes. Their products are industry proven and set the standard for reliability, speed, and uniformity in plasma processing.

Contact information:

Plasma Etch, Inc.

3522 Arrowhead Drive

Carson City, NV 89706

(775) 883-1366

You can view the original Press Release here:

Plasma Polymerization line of Plasma Systems Creates Water-Repellent Surfaces

The system uses liquid monomer vapors in plasma to deposit a thin layer of material to create a hydrophobic surface, which can be valuable before many subsequent manufacturing processes.

Plasma Etch’s polymerization line of plasma systems includes PE-100, PE-200 and BT-1 based machines. Each system includes heated-liquid monomer vapor delivery integrated into the gas delivery system, which is said to provide reliability and repeatability. The company says that the system control is handled by its automated software, which is designed to provide a seamless experience for the user.

According to the company, the systems perform all the functions of a standard plasma system, including cleaning, surface activation and etching. All polymerization series plasma systems feature 13.56 MHz plasma with automatic matching networks, which are said to help users lower their environmental footprint.

Visit Plasma Etch.

View the original press release here: