Plasma Etch, Inc. announces patented Gasless Technology on the Mark II Plasma System
Posted December 29th, 2016 in Press Release
Carson City, NV – Plasma Etch Inc, a leader in plasma treatment, has introduced the company’s patented gasless etching technology on the Mark II line of plasma etchers and desmear systems.
This is a breakthrough innovation allowing circuit board manufacturers to perform desmear and etch back processes without the added expense and environmental impact of CF4 gas. The system uses only electricity and oxygen gas.
The Mark II is an industrial etching system popular with PCB manufacturers. The patented gasless technology, originally developed for larger systems, has been condensed and allows the Mark II to offer unmatched speed and uniformity.
Not only can you etch and desmear without CF4 gas, but the gasless Mark II will etch faster and more uniformly than a standard Mark II running CF4.
Plasma Etch’s full line of plasma products may be viewed anytime on their website: www.plasmaetch.com
About Plasma Etch: Plasma Etch has been a leading manufacturer and industry innovator since 1980. The company holds several patents for the invention, development and manufacturing of groundbreaking innovations, paving the way for plasma technology and the enhancement of quality manufacturing worldwide. Plasma Etch specializes in plasma cleaning solutions of all sizes. Their products are industry proven and set the standard for reliability, speed and uniformity in plasma processing.
Plasma Etch, Inc.
3522 Arrowhead Drive
Carson City, NV 89706